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Thomas Goebel
Thomas Goebel
Materials science
Polymer chemistry
Chemistry
Copper
Soldering
3
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Process for the deposition of aluminum in three layers for a contact with a large aspect ratio
2003
Thomas Goebel
Rajeev Malik
Werner Dr. Robl
Mihel Seitz
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Lower copper content to reduce short circuits in AlCu lines
2003
Chester T. Dziobkowski
Thomas Goebel
Brian San Jose Hughes
Roy C. Iggulden
Michael M. Iwatake
Donna D. Miura
Werner Robl
Padraic Shafer
Jay W. Strane
Kwong Hon Wong
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