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John Thornell

Rudolph Technologies, Inc.

5

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7

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Smart in-line defectivity/metrology process control solution for advanced 3D integration

2016
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Improving mean time to develop micro-bump/pillar fabrication process for vertical interconnections by combined defectivity and metrology approach

2015
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Through silicon via process characterization by integrated inspection/metrology solutions in visible and infrared domain

2015 ASMC | Advanced Semiconductor Manufacturing Conference
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Through Silicon Via Process Characterization by Integrated Inspection/Metrology Solutions in Visible and Infrared Domain Category: AM: Advanced Metrology

2015
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Automated Metrology Improves Productivity and Yields for Wafer Level Packaging in High Volume Manufacturing

2014
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