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S. Amari
S. Amari
Fujitsu
Electronic engineering
Stress (mechanics)
Copper-wiring
Copper
Dielectric strength
3
Papers
2
Citations
0
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Further Enhancement of Electro-migration Resistance by Combination of Self-aligned Barrier and Copper Wiring Encapsulation Techniques for 32-nm Nodes and Beyond
2008
IITC | International Interconnect Technology Conference
H. Kudo
Masaki Haneda
T. Tabira
Michie Sunayama
Nobuyuki Ohtsuka
Noriyoshi Shimizu
H. Ochimizu
Atsuhiro Tsukune
Takashi Suzuki
Hideki Kitada
S. Amari
Hideya Matsuyama
Tamotsu Owada
Hirofumi Watatani
T. Futatsugi
T. Nakamura
T. Sugii
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Citations (1)
Self-aligned Barrier andCopperWiringEncapsulation Techniques for32-nmNodesandBeyond
2008
H. Kudo
Masaki Haneda
T. Tabira
Michie Sunayama
Nobuyuki Ohtsuka
Noriyoshi Shimizu
H. Ochimizu
Atsuhiro Tsukune
Takashi Suzuki
Hideki Kitada
S. Amari
Hideya Matsuyama
Tamotsu Owada
Hirofumi Watatani
T. Futatsugi
T. Nakamura
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Copper Wiring Encapsulation with Ultra-thin Barriers to Enhance Wiring and Dielectric Reliabilities for 32-nm Nodes and Beyond
2007
IEDM | International Electron Devices Meeting
H. Kudo
Masaki Haneda
H. Ochimizu
Atsuhiro Tsukune
S. Okano
Nobuyuki Ohtsuka
Michie Sunayama
Hisaya Sakai
Takashi Suzuki
Hideki Kitada
S. Amari
T. Tabira
Hideya Matsuyama
Noriyoshi Shimizu
T. Futatsugi
T. Sugii
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Citations (1)
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