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Jung Kyu Han

University of California, Los Angeles

8

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Basic Study on Electromigration Phenomena in Pb-free Solder Joint

2013 Journal of Japan Institute of Electronics Packaging
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A new physical model for life time prediction of Pb-free solder joints in electromigration tests

2012 ECTC | Electronic Components and Technology Conference
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Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

2010 Journal of Applied Physics
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Electromigration failure with thermal gradient effect in SnAgCu solder joints with various UBM

2009 ECTC | Electronic Components and Technology Conference
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Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

2008 Applied Physics Letters
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Citations (46)