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Mark Privett
Mark Privett
Katholieke Universiteit Leuven
Wafer
Materials science
Wafer bonding
Composite material
support system
3
Papers
41
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Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications
2013
ECTC | Electronic Components and Technology Conference
Anne Jourdain
Alain Phommahaxay
Greet Verbinnen
Gayle Murdoch
Andy Miller
Kenneth June Rebibis
Alice Guerrero
Jeremy Mccutcheon
Mark Privett
Jason Neidrich
Gerald Beyer
Eric Beyne
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Citations (21)
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
2010
DIC | IEEE International D Systems Integration Conference
Anne Jourdain
T. Buisson
Alain Phommahaxay
Mark Privett
Dan Wallace
Sumant Sood
Peter Bisson
Eric Beyne
Youssef Travaly
Bart Swinnen
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Citations (17)
1