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Chao-Pin Yeh

Motorola

21

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289

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Flush-porting method and device for reduction of wind-induced noise in a microphone

2000 Journal of the Acoustical Society of America
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High Resolution and Computer Vision Strain Measurement for Microelectronic Packages

1999
- Hua Lu
- Chao-Pin Yeh
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Solder joint design optimization for fine pitch component applications

1998 ITherm | Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
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Experimental study on mechanical, thermomechanical, and optomechanical behaviors of holographic materials

1998 Proceedings of SPIE
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Matrix Cracking With Irregular Fracture Fronts as Observed in Fiber Reinforced Ceramic Composites

1998 Journal of Engineering Materials and Technology-transactions of The Asme
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The effect of fiber bridging on self-similar crack growth: A penny-shaped crack evolvement in a unidirectional, fibrous composite

1998 Studies in Applied Mechanics
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Electro-thermo-mechanical responses of conductive adhesive materials

1997 IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
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Cure kinetics and mechanical properties of conductive adhesive

1997 ECTC | Electronic Components and Technology Conference
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Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

1996
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Process induced residual stresses in isotropically conductive adhesive joints

1996 IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C
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Citations (14)