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Ju-Hyun Lyu
Ju-Hyun Lyu
Samsung
Materials science
Composite material
Electronic engineering
Integrated circuit packaging
Temperature cycling
3
Papers
23
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Reliability of flip chip BGA package on organic substrate
2000
ECTC | Electronic Components and Technology Conference
Eun-Chul Ahn
Tae-Je Cho
Jong-Bo Shin
Ho-Joong Moon
Ju-Hyun Lyu
Kiwon Choi
Sa Yoon Kang
Se-Yong Oh
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Citations (8)
Mechanisms of die and underfill cracking in flip chip PBGA package
2000
APMPPI | International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces
Jong-Bo Shim
Eun-Chul Ahn
Tae-Je Cho
Ho-Jung Moon
Tae-Gyeong Chung
Ju-Hyun Lyu
Hung-Kyu Kwon
Su-Yoon Kang
Se-Yong Oh
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Citations (13)
Development of chip scale package for DRAM
1999
IEMT | International Electronics Manufacturing Technology Symposium
Tae-Je Cho
Eun-Chul Ahn
Ju-Hyun Lyu
M.G. Chung
Se-Yong Oh
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Citations (2)
1