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Jun Mukawa
Jun Mukawa
Soldering
Composite material
Materials science
Bumping
Photoresist
5
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19
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Development status of photoresist as mask material for Injection Molded Solder (IMS) technique
2016
Koichi Hasegawa
Jun Mukawa
Seiichirou Takahashi
Chihiro Kobata
Kenzo Ohkita
Shiro Kusumoto
Toyohiro Aoki
Eiji Nakamura
Takashi Hisada
Hiroyuki Mori
Yasumitsu Orii
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Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
2016
ECTC | Electronic Components and Technology Conference
Toyohiro Aoki
Takashi Hisada
Eiji Nakamura
Yasuharu Yamada
Hiroyuki Mori
Yasumitsu Orii
Seiichirou Takahashi
Jun Mukawa
Chihiro Kobata
Kenzou Ohkita
Koichi Hasegawa
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Development of Liquid Photoresist for IMS (Injection Molded Solder) with High Thermal Stability
2016
Journal of Photopolymer Science and Technology
Jun Mukawa
Seiichirou Takahashi
Chihiro Kobata
Kenzo Ohkita
Shiro Kusumoto
Koichi Hasegawa
Toyohiro Aoki
Eiji Nakamura
Takashi Hisada
Hiroyuki Mori
Yasumitsu Orii
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Development and Commercialization of Solder Bump Fabrication Technology with Molten Solder Injection Method
2015
Journal of Japan Institute of Electronics Packaging
Toyohiro Aoki
Kazushige Toriyama
Yasumitsu Orii
Hiroyuki Mori
Akira Takaguchi
Takashi Nauchi
Hideki Nakamura
Seiichirou Takahashi
Jun Mukawa
Koichi Hasegawa
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IMS (Injection Molded Solder) Technology with Liquid Photoresist for Ultra Fine Pitch Bumping
2014
Toyohiro Aoki
Kazushige Toriyama
Hiroyuki Mori
Yasumitsu Orii
Jae-Woong Nah
Seiichirou Takahashi
Jun Mukawa
Kouichi Hasegawa
Shiro Kusumoto
Katsumi Inomata
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Citations (16)
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