author-photo

S. Rodet

Katholieke Universiteit Leuven

6

Papers

145

Citations

Citation Trend

Filter By

Papers (3) Sort By

Journal Conference Others

Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed

2011 Journal of The Electrochemical Society
Show All
- Source
- Cite
- Save
Citations (31)
Copper plating for 3D interconnects

2011 Microelectronic Engineering
Show All
- Source
- Cite
- Save
Citations (56)
Front side metallization of silicon solar cells by Copper-platingaP

2010
Show All
- Source
- Cite
- Save
Citations (0)