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Ying-Ting Chung
Ying-Ting Chung
National Chiao Tung University
Direct bonding
Deformation (mechanics)
Optoelectronics
Surface finish
internal friction
2
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4
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0
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Investigation of Low Temperature Cu-Cu Direct Bonding with Pt Passivation Layer in 3D Integration
2021
IEEE Transactions on Components, Packaging and Manufacturing Technology
Demin Liu
Tsung-Yi Kuo
Yu-Wei Liu
Zhong-Jie Hong
Ying-Ting Chung
Tzu-Chieh Chou
Han-Wen Hu
Kuan-Neng Chen
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Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere
2019
IEDM | International Electron Devices Meeting
Tzu-Chieh Chou
Kai-Ming Yang
Jian-Chen Li
Ting-Yang Yu
Ying-Ting Chung
Cheng-Ta Ko
Yu-Hua Chen
Tzyy-Jang Tseng
Kuan-Neng Chen
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