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Oliver Wang
Oliver Wang
United Microelectronics Corporation
Chemical-mechanical planarization
Materials science
Polishing
Electronic engineering
Optoelectronics
4
Papers
8
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Optimized copper chemical mechanical polishing with CVD Co barrier at 14nm technology node
2014
H.K. Hsu
Y. M. Lin
L. C. Hsu
Y. T. Li
Y. L. Liu
W. S. Sie
Oliver Wang
C.C. Huang
J.Y. Wu
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Citations (6)
High-k metal gate poly opening polish at 28nm technology polish rate and selective study
2014
W. S. Sie
Y. L. Liu
J. L. Chen
W. C. Hong
R.P. Huang
Po-Cheng Huang
Y. T. Li
C. H. Lin
C. H. Kung
Y. M. Lin
R. G. Lin
H.K. Hsu
Oliver Wang
J. F. Lin
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Wafer extreme-far edge related study in BEOL (Back-End-of-Line) including BEOL chemical mechanical polishing at 28nm technology node and beyond
2014
Y. M. Lin
S. K. Hsu
L. C. Hsu
C. H. Hsu
C. L. Wu
W. K. Lee
W. C. Lin
W. S. Sie
Y. L. Liu
Y. T. Lee
Oliver Wang
C.C. Huang
J. F. Lin
J.Y. Wu
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Defect reduction with CMP pad dressing optimization
2014
Y. L. Liu
Wu-Sian Sie
Chun-Lin Chen
Po-Cheng Huang
Yu-Ting Li
Renn Guey Lin
Yu Min Lin
Hisn-Kuo Hsu
Oliver Wang
J. F. Lin
J.Y. Wu
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Citations (2)
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