Old Web
English
Sign In
Acemap
>
authorDetail
>
F. Foumel
F. Foumel
Composite material
Silicon
Electronic engineering
Materials science
Optoelectronics
4
Papers
6
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (4)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
太陽電池応用のためのSiウエハボンディングアプローチへの様々なGaAs【Powered by NICT】
2017
V. Larrey
Laura Vauche
Elias Veinberg-Vidal
M. Tedjini
C Morales
F. Foumel
K. Abadie
Show All
Source
Cite
Save
Citations (0)
Various GaAs to Si wafer bonding approaches for solar cells applications
2017
Vincent Larrey
Laura Vauche
Elias Veinberg-Vidal
Marwan Tedjini
Christophe Morales
F. Foumel
K. Abadie
Show All
Source
Cite
Save
Citations (0)
High density integration of Germanium photodiodes on CMOS wafer
2015
GFP | International Conference on Group IV Photonics
S. Malhouitre
Philippe Grosse
J.-M. Hartmann
F. Foumel
Marco Jan-Jaco Wieland
T. van de Peut
Christophe Kopp
Show All
Source
Cite
Save
Citations (0)
Challenges and solutions for ultra-thin (50 μm) silicon using innovative ZoneBOND™ process
2012
EPTC | Electronics Packaging Technology Conference
K Vial
A. Jouve
Emmanuel Rolland
Perceval Coudrain
Christophe Aumont
F. Foumel
Michel Pellat
Pierre Montmeat
N. Allouti
R. Eleouet
M. Argoud
J. Dechamp
Laurent Bally
Lionel Vignoud
R. Hida
C. Ratin
T. Magis
V. Loup
Riadh Kachtouli
Laurence Gabette
T. Mourier
C. Laviron
S. Cheramy
N. Sillon
Show All
Source
Cite
Save
Citations (6)
1