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C. S. Lau
C. S. Lau
University of Minho
Composite material
Contact angle
Organic solderability preservative
Soldering
Sessile drop technique
2
Papers
13
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Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates
2018
Journal of Materials Engineering and Performance
Delfim Soares
H. Leitão
C. S. Lau
José Carlos Teixeira
L. Ribas
R. Alves
S. F. C. F. Teixeira
Maria Fátima Cerqueira
F. Macedo
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Citations (2)
Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphere
2015
Journal of Materials Science: Materials in Electronics
C. Gonçalves
H. Leitão
C. S. Lau
José Carlos Teixeira
L. Ribas
S. F. C. F. Teixeira
Maria Fátima Cerqueira
F. Macedo
Delfim Soares
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Citations (11)
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