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tositada nezu
tositada nezu
Composite material
Materials science
Wire bonding
Gilding
Electronic circuit
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Sealing structure of the multi-chip module
1999
osamu maruyama
takahiro daikoku
takayuki uta
takesi yamaguti
suu hiko matusita
tositada nezu
ken'iti kasai
kouiti takahasi
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Solder connected electronic circuit device and the solder connection and solder gilding connection terminal
1989
ç§æ ä½ã æ¨
ryouhei satou
masahide harada
nisan sati kobayasi
tositada nezu
mitugu sirai
ryuuzi takenaka
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Au film composition for wire bonding
1987
ryouhei satou
Fudadao Zong
tositada nezu
hideo siroisi
tuyosi fuzita
kousei tani
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