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Reynaldo Joven
Reynaldo Joven
Composite material
Materials science
Thermal conductivity
Copper
Silicon carbide
2
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High Reliability Engineered Copper SMT Bonding Material
2021
IEEE-NANO | International Conference on Nanotechnology
Alfred A. Zinn
Randall M. Stoltenberg
Reynaldo Joven
Nhi Ngo
Alexander Capanzana
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Next-generation Packaging Enabled by an Engineered Copper Nanomaterial
2021
IEEE-NANO | International Conference on Nanotechnology
Randall M. Stoltenberg
Alex Capanzana
Agustín Vega
Nhi Ngo
Reynaldo Joven
Li Zhenggang
Chee Lip Gan
Yeng Ming Lam
Alfred A. Zinn
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