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Jason James Dominguez

5

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Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology

2019 Journal of The Electrochemical Society
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Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs

2019 Journal of The Electrochemical Society
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Utilizing Electroplating for High Aspect Ratio Mesoscale Fabrication - Filling Forming and Coating.

2017
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a Unique 3D Integration Approach for SOI Substrates - Mating Device Layer CVD W Filled Tsvs with Handle Layer ECD Cu Filled Tsvs

2016
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ALD Platinum Substrate Preparation and Electrodeposition of Copper into Extremely Deep through-Silicon-Vias

2016
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