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Fumihiro Inoue

Tohoku University

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(Invited) All-Wet TSV Fabrication Using Electroless Plated Barrier and Cu Seed Layers with Pd Nanoparticle Catalyst

2016
- Fumihiro Inoue
- Shoso Shingubara
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Stability Evaluation of Non-Agglomerated Pd Nanoparticle Catalysts for Electroless Deposition

2015
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Control of the Morphology of Si Nanostructure Using Single-Step Metal Assisted Etching Method

2013
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Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV

2013 DIC | IEEE International D Systems Integration Conference
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Electroless Barrier Deposition with Pd Nanoparticle Catalyst in High Aspect Ratio TSV

2011
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