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R. J. Gleixner
R. J. Gleixner
Intel
Electromigration
Thin film
Grain boundary diffusion coefficient
Nucleation
Electronic engineering
1
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6
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In-situ studies of electromigration voiding in passivated copper interconnects
1999
N. E. Meier
T. Marieb
Paul A. Flinn
R. J. Gleixner
John C. Bravman
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Citations (6)
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