Old Web
English
Sign In
Acemap
>
authorDetail
>
Ramin Azadeh
Ramin Azadeh
Electronic engineering
Soldering
Interposer
Surface-mount technology
Composite material
5
Papers
14
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (5)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
flexPAC-development and qualification of a low cost CSP
1998
Journal of PeriAnesthesia Nursing
G. Azdasht
Ramin Azadeh
Christine Kallmayer
Sabine Anhöck
E. Busse
Hermann Oppermann
Rolf Aschenbrenner
Herbert Reichl
Show All
Source
Cite
Save
Citations (0)
Reliability investigations for flip-chip on flex using different solder materials
1998
ECTC | Electronic Components and Technology Conference
Christine Kallmayer
H. Oppermann
Sabine Anhöck
Ramin Azadeh
R. Aschenbrenner
Herbert Reichl
Show All
Source
Cite
Save
Citations (6)
A low cost approach to CSP based on meniscus bumping, laser bonding through flex and laser solder ball placement
1997
EPTC | Electronics Packaging Technology Conference
Christine Kallmayer
Ramin Azadeh
Karl-Friedrich Becker
Sabine Anhöck
Erik Busse
Hermann Oppermann
Ghassem Azdasht
Rolf Aschenbrenner
Herbert Reichl
Show All
Source
Cite
Save
Citations (1)
Apparatus and method for simultaneously depositing and remelting of a plurality of solder balls to a substrate
1997
Ghassem Azdasht
Ramin Azadeh
Clemens Ruethnick
Martin Lange
Show All
Source
Cite
Save
Citations (0)
A new approach to chip size package using meniscus soldering and FPC-bonding
1997
ECTC | Electronic Components and Technology Conference
Christine Kallmayer
Erik Jung
Paul Kasulke
Ramin Azadeh
Ghassem Azdasht
Elke Zakel
Herbert Reichl
Show All
Source
Cite
Save
Citations (7)
1