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Abdurrahman Öz

Fraunhofer Society

6

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44

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Modeling and minimizing the inductance of bond wire interconnects

2013 SPI | IEEE Workshop on Signal and Power Integrity
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Electrical modeling of the power delivery to an LED array packaged in a textile

2013 EDAPS | Electrical Design of Advanced Packaging and Systems Symposium
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Characterization of Interconnects and RF Components on Glass Interposers

2012
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Impact of Process Tolerances on the Performance of Bond Wire Antennas at RF/Microwave Frequencies

2011
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