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Benoit Papineau
Benoit Papineau
Electronic engineering
Composite material
Thermoplastic
Adhesive bonding
Polyimide
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Warpage Control During Mass Reflow Flip Chip Assembly Using Temporary Adhesive Bonding
2018
ECTC | Electronic Components and Technology Conference
Normand-Pierre Goodhue
David Danovitch
Jeff Moussodji Moussodji
Benoit Papineau
Eric Duchesne
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