Old Web
English
Sign In
Acemap
>
authorDetail
>
Houdun Zhang
Houdun Zhang
Integrated circuit
Wafer
Soldering
Solder mask
Composite material
1
Papers
0
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Investigation on the Warpage of Fan-Out Wafer-Level Packaging Using Curing Reaction Kinetics of Composites
2021
ICEPT | International Conference on Electronic Packaging Technology
Wei Li
Jianhong Huang
Jinbo Xiao
Yiyong Huang
Houdun Zhang
Daquan Yu
Show All
Source
Cite
Save
Citations (0)
1