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Kengo Uchida
Kengo Uchida
Toshiba
Materials science
Manganese
bonding strength
Scanning electron microscope
Metallurgy
3
Papers
2
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Photoelectroscopic Study of Mn Barrier Layer on SiO 2 for Si Wafer Bonding Process
2019
DIC | IEEE International D Systems Integration Conference
Takahiro Nagata
Kazumichi Tsumura
Kenro Nakamura
Kengo Uchida
Jin Kawakita
Toyohiro Chikyow
Kazuyuki Higashi
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Effect of N 2 plasma treatment in Cu/SiO 2 hybrid bonding using ultra-thin manganese film
2019
Kazumichi Tsumura
Kengo Uchida
Kenro Nakamura
Takahiro Nagata
Kazuyuki Higashi
Akihiro Kojima
Hideki Shibata
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Novel Bonding Process Using Ultra-thin Mn for Highly Robust and Reliable Cu/SiO Hybrid Bonding
2018
IITC | International Interconnect Technology Conference
Kengo Uchida
Kazumichi Tsumura
Kenro Nakamura
Kazuyuki Higashi
Yoshiaki Sugizaki
Hideki Shibata
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