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Ying-Te Ou
Ying-Te Ou
Materials science
Electronic engineering
Microelectromechanical systems
Wafer
Insertion loss
4
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3
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A Novel 3D IC Wafer-Level-Package for New Wave MEMS
2017
ECTC | Electronic Components and Technology Conference
Che-Hau Huang
Sebastian Schuler-Wakins
Ying-Te Ou
Yung-Hui Wang
Ralf Reichenbach
David Dmitry Polityko
Uwe Hansen
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3D WL MEMS with Various TSV Technologies' Thermo-Mechanical Analysis
2016
ECTC | Electronic Components and Technology Conference
Ying-Te Ou
Hung-Hsiang Cheng
Dao-Long Chen
Hsiao-Yen Lee
Ying-Chih Lee
Meng Kai Shih
Chin-Cheng Kuo
Ping-Feng Yang
Chen-Chao Wang
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Design and modeling methodology of embedded passives substrate in a compact wireless connectivity module
2011
ECTC | Electronic Components and Technology Conference
Chi-Tsung Chiu
Pao-Nan Lee
Chi-Han Chen
Yuan-Hung Lin
Yei-Shen Wu
Ying-Te Ou
Chih-Jing Hsu
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Design and Modeling Methodology of Embedded Passives Substrate in a Compact Wireless Connectivity Module
2011
Electronic Components and Technology Conference
Chi-Tsung Chiu
Pao-Nan Lee
Chi-Han Chen
Yuan-Hung Lin
Yei-Shen Wu
Ying-Te Ou
Chih-Jing Hsu
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