Old Web
English
Sign In
Acemap
>
authorDetail
>
Sebastian Tismer
Sebastian Tismer
Fraunhofer Society
Materials science
Wafer
Composite material
Electronic engineering
Thin film
4
Papers
27
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (4)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Evaluation of the bond quality of laser-joined sapphire wafers using a fresnoite-glass sealant
2016
Microsystem Technologies-micro-and Nanosystems-information Storage and Processing Systems
Araceli de Pablos-Martín
Sebastian Tismer
Falk Naumann
Michael Krause
Michael Lorenz
Marius Grundmann
Th. Höche
Show All
Source
Cite
Save
Citations (8)
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
2015
Microsystem Technologies-micro-and Nanosystems-information Storage and Processing Systems
Sebastian Brand
Sebastian Tismer
Sigurd T. Moe
Kari Schjølberg-Henriksen
Show All
Source
Cite
Save
Citations (4)
Structural Characterization of Laser Bonded Sapphire Wafers Using a Titanium Absorber Thin Film
2015
Journal of Materials Science & Technology
A. de Pablos-Martín
Sebastian Tismer
Th. Höche
Show All
Source
Cite
Save
Citations (6)
Acoustic imaging of bump defects in flip-chip devices using split spectrum analysis
2013
IUS | Internaltional Ultrasonics Symposium
Sebastian Tismer
Sebastian Brand
Sandy Klengel
Matthias Petzold
Peter Czurratis
Show All
Source
Cite
Save
Citations (9)
1