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Pae Sangwoo
Pae Sangwoo
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基板レベルの熱サイクル信頼性(BLR)を改善するためのウエハレベルパッケージにおけるダミーボールアレイの最適設計【JST・京大機械翻訳】
2018
Jeong Seongwon
Kim JinSeok
Kim Ayoung
Kim Byungwook
Lee Moonsoo
Chang Jaewon
Baick In Hak
Kang Hanbyul
Ji Younggeun
Shin SangChul
Pae Sangwoo
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フリップチップパッケージのパッケージ間相互作用(CPI)信頼性に及ぼすEMC特性の影響【JST・京大機械翻訳】
2017
Baick In Hak
Lee Moon Soo
Lee Minwoo
Kim Byungwook
ha Sang Su
Jeong Seong Won
Kim Min
Pae Sangwoo
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Simulation-based analysis on EMI effect in LPDDR interface for mitigating RFI in a mobile environment
2016
Workshop on Signal Propagation on Interconnects
Kim Seil
Moon Sungwook
Lee Seungbae
Yi Donny
Park Goeun
Shin SangChul
Pae Sangwoo
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モバイル環境におけるRFIを緩和するためのLPDDR界面におけるEMI効果のシミュレーションに基づく解析【Powered by NICT】
2016
Kim Seil
Moon Sungwook
Lee Seungbae
Yi Donny
Park Goeun
Shin SangChul
Pae Sangwoo
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32nm high-κと金属ゲート論理トランジスタ技術の信頼性評価
2010
IRPS | International Reliability Physics Symposium
Pae Sangwoo
Ashok Ashwin
Choi Jingyoo
Ghani Tahir
He Jun
Lee Seok-Hee
Lemay Karen
Liu Mark
LU Ryan
Packan Paul
Parker Chris
Purser Richard
St. Amour Anthony
Woolery Bruce
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