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Mari Yamshita

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Vibration Endurance Test of SiC Half-Bridge Power Modules built in In-Wheel Motor

2019 The Japan Society of Applied Physics
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Over Temperature Torelability of SiC Power Module molded with Thermoset EMC

2018 The Japan Society of Applied Physics
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Reliability Assessment of SiC Power Module using TO-247 Package molded with Thermoset EMC

2017 The Japan Society of Applied Physics
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Integrated Degradation Analysis for SiC Die Attachment Systems subjected to Thermal Cycle Test

2017 The Japan Society of Applied Physics
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Ongoing Degradation Analysis for Power Semiconductor Die Attachment subjected to Thermal Cycle Test

2016 The Japan Society of Applied Physics
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