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Tien-Jen Cheng
Tien-Jen Cheng
GlobalFoundries
Wafer
Copper
Electroplating
Annealing (metallurgy)
Composite material
3
Papers
2
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Modulation of Within-Wafer and Within-die Topography for Damascene Copper in Advanced Technology
2018
IITC | International Interconnect Technology Conference
Wei-Tsu Tseng
Tien-Jen Cheng
Shafaat Ahmed
Jusang Lee
Frieder H. Baumann
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Defect improvement by optimizing electroplating in BEOL sub-50nm pitch
2017
ASMC | Advanced Semiconductor Manufacturing Conference
Shafaat Ahmed
Ketan Shah
Tien-Jen Cheng
Adam da Silva
Mukta Sharma
Teng-Yin Lin
Dinesh Koli
Anbu Selvam Km Mahalingam
Stephan Grunow
Craig Child
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Defect improvement by optimizing electroplating in BEOL sub-50nm pitch
2017
MIPRO | International Convention on Information and Communication Technology, Electronics and Microelectronics
Shafaat Ahmed
Ketan Shah
Tien-Jen Cheng
Adam da Silva
Mukta Sharma
Teng-Yin Lin
Dinesh Kumar Koli
Anbu Selvam Km Mahalingam
Stephan Grunow
Craig Child
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