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J. W. Kim
J. W. Kim
Andong National University
M.2
Electromigration
Annealing (metallurgy)
Engineering
Anodic bonding
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Sub-micron aligned Cu-Cu direct bonding for TSV stacking
2010
ASMC | Advanced Semiconductor Manufacturing Conference
Bioh Kim
E. Cakmak
T. Matthias
Eun-Jung Jang
J. W. Kim
Young-Bae Park
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