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Chai Tai Chong
Chai Tai Chong
National University of Singapore
Materials science
Composite material
Delamination
Oxide
Copper oxide
1
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44
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Investigation on the effect of copper leadframe oxidation on package delamination
1995
ECTC | Electronic Components and Technology Conference
Chai Tai Chong
Alan Leslie
Lim Thiam Beng
C Lee
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Citations (44)
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