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Hideko Mukaida
Hideko Mukaida
Toshiba
Materials science
Weibull distribution
Composite material
Wafer dicing
Wire bonding
3
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3
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0
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Bringing in Cryogenics to Storage: Characteristics and Performance Improvement of 3D Flash Memory
2021
IMW | International Memory Workshop
Yuta Aiba
Hitomi Tanaka
Takashi Maeda
Keiichi Sawa
Fumie Kikushima
Miura Masayuki
Fujisawa Toshio
Mie Matsuo
Hideto Horii
Hideko Mukaida
Tomoya Sanuki
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Estimation method of cracking probability of stacked overhang die during wire bonding
2015
ICEP-IAAC | International Conference on Electronic Packaging and iMAPS All Asia Conference
Kanako Sawada
Hideo Aoki
Eigo Matsuura
Hideko Mukaida
Fumiyoshi Minami
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Evaluation of adhesion strength of semiconductor package with the Weibull stress
2012
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Eigo Matsuura
Kanako Sawada
Hideko Mukaida
Hideo Aoki
Fumiyoshi Minami
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