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Bawa Singh

Banaras Hindu University

6

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83

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Wafer level CSP with ultra-high thermal reliability lead-free alloys

2015 EPTC | Electronics Packaging Technology Conference
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Thermal and mechanical reliability of low-temperature solder alloys for handheld devices

2014 EPTC | Electronics Packaging Technology Conference
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Drop Shock Reliability of Lead-Free Alloys - Effect of Micro-Additives

2007 ECTC | Electronic Components and Technology Conference
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Some aspects related to the asymptotic solutions of the laminar boundary-layer equations with heat flux

1990 Astrophysics and Space Science
- Anil Kumar
- Bawa Singh
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