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Armand Beyer

GlobalFoundries

8

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38

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A New In Situ Microscopy Approach to Study the Degradation and Failure Mechanisms of Time-Dependent Dielectric Breakdown: Set-Up and Opportunities**

2014 Advanced Engineering Materials
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Empirical BEOL-TDDB evaluation based on I(t)-trace analysis

2014 Microelectronics Reliability
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Advanced metallization concepts and impact on reliability

2014 Japanese Journal of Applied Physics
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An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures

2013 IRPS | International Reliability Physics Symposium
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Backend-of-line reliability improvement options for 28nm node technologies and beyond

2011 IITC | International Interconnect Technology Conference
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