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Dennis Prem Kumar Chandran
Dennis Prem Kumar Chandran
Intel
Soldering
Materials science
Electronic packaging
Engineering
Thermal
4
Papers
7
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Success story in driving quality enhancements in the indirect materials used in assembly/test electronic packaging manufacturing
2012
IEMT | International Electronics Manufacturing Technology Symposium
Dennis Prem Kumar Chandran
Ong Chee Teong
Mohd Jaffri Razai
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Success story of collaboration between Intel and Malaysian universities to establish and enhance teaching and research in Electronic Packaging
2010
IEMT | International Electronics Manufacturing Technology Symposium
Dennis Prem Kumar Chandran
Yeek Kooi
Mohd Hasri Mohd Harizan
Chee Choong Kooi
Teoh Teik Hoy
Chong Kim Foong
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Effects of Thermal Lids Gold Plating Thickness on Thermal Interface Reliability for Flip Chip Packaging
2007
Chin Hock Toh
Arun Raman
Thomas Fitzgerald
Madhuri R. Narkhede
Alfred A. La Mar
Dennis Prem Kumar Chandran
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Thermal and Physical Characterization and Curing Kinetics Study of a Novel Curable Fillet Forming Ball Attach Flux for Improvement of Solder Joint Reliability on Ball Grid Array Packages
2003
Dennis Prem Kumar Chandran
Yi He
Eng Chiang Gan
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