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Tsuyoshi Kanki

Fujitsu

7

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28

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Development of Highly Reliable Cu Wiring Technology for 2.1/2.5D-IC by Applying Semiconductor Manufacturing Process

2015 Journal of Japan Institute of Electronics Packaging
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Chemical and Mechanical Properties of Cu Surface Reaction Layers in Cu-CMP to Improve Planarization

2013 ECS Journal of Solid State Science and Technology
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Cu Wiring Technology for 3D/2.5D Packaging

2013 IEICE technical report. Speech
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Development of highly reliable Cu wiring of L/S=1/1µm for chip to chip interconnection

2012 IITC | International Interconnect Technology Conference
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On the Elements of High Throughput Cu-CMP Slurries Compatible with Low Step Heights

2008 IITC | International Interconnect Technology Conference
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Etching Rate Enhancement of Copper by Adding Sulfur Compounds in Chemical-Mechanical Polishing Slurries

2007
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