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James A. Wrezel
James A. Wrezel
Motorola
Engineering
Intermetallic
Alloy
Drop impact
Liquidus
1
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15
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Drop impact reliability of Sn–1.0Ag–0.5Cu BGA interconnects with different mounting methods
2012
Microelectronics Reliability
Bo Wang
Jiajun Li
Anthony Gallagher
James A. Wrezel
Pongpinit Towashirporn
Naiqin Zhao
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Citations (15)
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