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Thorsten Heuser
Thorsten Heuser
EPCOS AG
Surface acoustic wave
Wafer
Resist
Materials science
Wafer-level packaging
2
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7
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Adhesive Wafer Bonding Applied for Fabrication of True-Chip-Size Packages for SAW Devices
2013
Thorsten Heuser
Christian Bauer
Viorel Dragoi
Gerald Mittendorfer
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Application of an Angular Exposure System to fabricate true-chip-size packages for SAW devices
2011
EMPC | European Microelectronics and Packaging Conference
Barbara L'huillier
Michael Hornung
Dietrich Tönnies
Michael Jacobs
Christian Bauer
Frank Hammer
Thorsten Heuser
G. Feiertag
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Citations (4)
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