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K. Kaletta
K. Kaletta
Electronic engineering
Electrical engineering
BiCMOS
Embedded system
Microelectromechanical systems
5
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82
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Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
2014
ECTC | Electronic Components and Technology Conference
Kai Zoschke
Martin Wilke
Matthias Wegner
K. Kaletta
C.-A. Manier
Hermann Oppermann
Matthias Wietstruck
Bernd Tillack
Mehmet Kaynak
Kenneth Lang
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Citations (5)
RF-MEMS switch module in a 0.25 μm BiCMOS technology
2012
SiRF | Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
Mehmet Kaynak
Matthias Wietstruck
Wogong Zhang
J. Drews
R. Scholz
D. Knoll
F. Korndörfer
Christian Wipf
K Schulz
Mohamed Elkhouly
K. Kaletta
Maria von Suchodoletz
Kai Zoschke
Martin Wilke
O. Ehrmann
Volker Muhlhaus
Gang Liu
Tatyana Purtova
A. C. Ulusoy
Hermann Schumacher
B. Tillack
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Citations (11)
Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads
2012
IMS | International Microwave Symposium
Mehmet Kaynak
Matthias Wietstruck
Wogong Zhang
J. Drews
R. Barth
D. Knoll
F. Korndörfer
R. Scholz
K Schulz
Christian Wipf
B. Tillack
K. Kaletta
Maria von Suchodoletz
Kai Zoschke
Martin Wilke
O. Ehrmann
A. C. Ulusoy
Tatyana Purtova
Gang Liu
Herman Schumacher
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Citations (14)
MEMS module integration into SiGe BiCMOS technology for embedded system applications
2011
Bipolar/BiCMOS Circuits and Technology Meeting
Mehmet Kaynak
Matthias Wietstruck
Wogong Zhang
J. Drews
D. Knoll
F. Korndörfer
Christian Wipf
K Schulz
Maria von Suchodoletz
Kai Zoschke
K. Kaletta
O. Ehrmann
S. Leidich
S. Kurth
Bernd Tillack
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Citations (1)
Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies
2007
IEEE Transactions on Advanced Packaging
Kai Zoschke
M. J. Wolf
Michael Töpper
O. Ehrmann
Thomas Fritzsch
K. Kaletta
F.J. Schmuckle
Herbert Reichl
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Citations (51)
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