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Chang Hsiao-Chun
Chang Hsiao-Chun
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複雑地形を有する二重自己集合法を用いた高度3D/2.5D集積パッケージングアプローチ,圧力センシングシステムのためのmicropinフィンヒートシンクインターポーザ【Powered by NICT】
2016
Hu-Yu Chen
Lin Chun-pin
Chang Hsiao-Chun
Yang Yu-tao
Chen Chi-Shi
Chen Kuan-Neng
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TSV埋込み溶解μ針アレイ,生体適合性フレキシブルインターポーザおよび神経記録回路を持つニューラルセンシングマイクロシステムの統合【Powered by NICT】
2016
Huang Yu-Chieh
Hu-Yu Chen
Huang Po-Tsang
Wu Shang-lin
You Yan-Huei
Chen Jr-Ming
Huang Yan-yu
Chang Hsiao-Chun
Lin Yen-Han
Duann Jeng-Ren
Chiu Tzai-Wen
Hwang Wei
Chuang Ching-Te
Chiou Jin-Chern
Chen Kuan-Neng
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An advanced 3D/2.5D integration packaging approach using double-self-assembly method with complex topography, and micropin-fin heat sink interposer for pressure sensing system
2016
International Electron Devices Meeting
Hu-Yu Chen
Lin Chun-pin
Chang Hsiao-Chun
Yang Yu-tao
Chen Chi-Shi
Chen Kuan-Neng
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