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Chen-hsiao Wang
Chen-hsiao Wang
Delamination
Electronic engineering
Chip-scale package
Wire bonding
System in package
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Impact of low-K wire bond stacked flip chip CSP package material on reliability test
2007
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Tsung Shu Lin
Chen-hsiao Wang
Joe Lin
K. M. Chen
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Citations (3)
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