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Wen Shan Tsai
Wen Shan Tsai
Materials science
Electronic engineering
Soldering
Interposer
Interconnection
4
Papers
13
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Continuous Infusion Compared with Intermittent Intravenous Infusion of Beta-Lactam Antibiotics for Critically Ill Patients: A Systematic Review and Meta-Analysis of Randomized Trials
2020
Chien Huei Huang
Ching-Yao Shih
Meng Keng Tsay
Shen-Pei Hsuan
Yung-Hsin Tseng
Wen Shan Tsai
Ching-Lan Cheng
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Board Level Reliability of Thinner Stacking Chips Package with Through Silicon Via Interposer
2018
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Wen Shan Tsai
Bruce Hsu
Fred Chang
Yun Long Huang
Joe Lin
C.F. Lin
C. Key Chung
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Analysis of Warpage and Stress Behavior in a Fine Pitch Multi-Chip Interconnection with Ultrafine-Line Organic Substrate (2.1D)
2018
ECTC | Electronic Components and Technology Conference
Chen Yu-huang
Yuan-Hung Hsu
Ying-Ju Lu
Kuo-Hua Yu
Wen Shan Tsai
Chang Fu Lin
C. Key Chung
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Generational changes of flip chip interconnection technology
2017
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Wen Shan Tsai
C. Y. Huang
C. Key Chung
K. H. Yu
C.F. Lin
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Citations (9)
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