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Kohki Okada
Kohki Okada
Intermetallic
Soldering
Wafer
Void (astronomy)
Bumping
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Study of Factors Which Influenced to Bump Shape and Voids in Bumps during Bump Formation with Solder Paste
2012
Masayuki Ishikawa
Hironori Uno
Takashi Yamaji
Ryuji Uesugi
Akihiro Masuda
Shingo Hirano
Fuyumi Mawatari
Natsuko Tanaka
Kohki Okada
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