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Juha Raumanni
Juha Raumanni
Nokia
Engineering
Electronic engineering
Creep
Temperature cycling
Interconnection
3
Papers
7
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Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules
2020
Microelectronics Reliability
Juha Hagberg
O. Nousiainen
Jussi Putaala
Olli Salmela
Juha Raumanni
Matti Rahko
Tero Kangasvieri
Jussi Jaaskelainen
Timo Galkin
Heli Jantunen
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BGA Interconnection Reliability in Mirrored Module Configurations
2017
IEEE Transactions on Components, Packaging and Manufacturing Technology
Juha Hagberg
Jussi Putaala
Juha Raumanni
Olli Salmela
Timo Galkin
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Citations (6)
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