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Vijay Sukumaran

Georgia Institute of Technology

19

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629

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Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications

2018 Journal of Materials Science: Materials in Electronics
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Citations (4)
End-to-End Integration of a Multi-die Glass Interposer for System Scaling Applications

2016 ECTC | Electronic Components and Technology Conference
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Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

2014 IEEE Transactions on Components, Packaging and Manufacturing Technology
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RF Device Integration on Glass Interposer toward 3D-IPAC Packages

2013
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Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages

2013 ECTC | Electronic Components and Technology Conference
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Citations (22)
Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

2013 ECTC | Electronic Components and Technology Conference
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Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

2012 IEEE Transactions on Components, Packaging and Manufacturing Technology
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Improvement of Plated Copper Adhesion in Glass Interposer Applications

2012
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Ultra-high I/O density glass/silicon interposers for high bandwidth smart mobile applications

2011 Electronic Components and Technology Conference
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Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

2011 ECTC | Electronic Components and Technology Conference
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Citations (63)