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Atsuko Sekiguchi

National Institute of Advanced Industrial Science and Technology

27

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637

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Through-Silicon-Via Interposers with Cu-Level Electrical Conductivity and Si-Level Thermal Expansion Based on Carbon Nanotube-Cu Composites for Microelectronic Packaging Applications

2021
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Indentation behavior of suspended single-walled carbon nanotube films

2021
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Application of Carbon Nanotubes Unravelled by Viscous Liquids

2020 Journal of The Society of Powder Technology, Japan
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Thermal expansion of Cu/carbon nanotube composite wires and the effect of Cu-spatial distribution

2020 Journal of materials research and technology
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Dispersions of High-Quality Carbon Nanotubes with Narrow Aggregate Size Distributions by Viscous Liquid for Conducting Polymer Composites

2020
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Unravelling Effect of Carbon Nanotube Powders by Highly Viscous Liquids

2019 Journal of The Society of Powder Technology, Japan
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Influence of Bundle Thickness Distribution and Pore Size Distribution on Tensile Strength of Single Wall Carbon Nanotube Films

2018 The Japan Society of Applied Physics
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Purifying carbon nanotube wires by vacuum annealing

2018 Materials Today: Proceedings
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Copper/carbon nanotube composites: research trends and outlook

2018 Royal Society Open Science
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Electrical performance of lightweight CNT-Cu composite wires impacted by surface and internal Cu spatial distribution

2017 Scientific Reports
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