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Tanja Braun
Tanja Braun
University of Bologna
Materials science
Microelectronics
Electronic engineering
Microtechnology
Nanotechnology
5
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5
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0
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Where is the Sweet Spot for Panel Level Packaging
2019
Tanja Braun
K.-F. Becker
O. Hoelck
S. Voges
Markus Woehrmann
L. Boettcher
Michael Toepper
Lutz Stobbe
Rolf Aschenbrenner
Martin Schneider-Ramelow
K.-D. Lang
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Process Optimization and Implementation of Online Monitoring Process in the Transfer Molding for Electronic Packaging
2019
Journal of microelectronics and electronic packaging
Burcu Kaya
Jan-Martin Kaiser
Karl-Friedrich Becker
Tanja Braun
Klaus-Dieter Lang
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Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging
2019
ECTC | Electronic Components and Technology Conference
Tanja Braun
Karl-Friedrich Becker
O. Hoelck
S. Voges
R. Kahle
Pascal Graap
Markus Wöhrmann
Rolf Aschenbrenner
Marc Dreissigacker
Martin Schneider-Ramelow
Klaus-Dieter Lang
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Lamination And Microstructuring Technology for a Bio-Cell Multiwell array
2008
arXiv: Other Computer Science
Erik Jung
Dionysios Manessis
A Neumann
Lars Böttcher
Tanja Braun
Jörg Bauer
Herbert Reichl
Bruno Iafelice
Federica Destro
Roberto Gambari
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Lamination And Microstructuring Technology for a Bio-Cell Multiwell array
2007
DTIP | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Erik Jung
Dionysios Manessis
Alexander Neumann
Lars Böttcher
Tanja Braun
Jörg Bauer
Herbert Reichl
Bruno Iafelice
Federica Destro
Roberto Gambari
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