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John J. Konrad
John J. Konrad
Intermetallic
Composite material
Electroplating
Dissolution
Reflow soldering
2
Papers
97
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Interfacial reaction studies on lead (Pb)-free solder alloys
2002
IEEE Transactions on Electronics Packaging Manufacturing
Sung K. Kang
D.-Y. Shih
Keith E. Fogel
Paul A. Lauro
Myung-Jin Yim
Gerald G. Advocate
M. Griffin
Charles Goldsmith
Donald W. Henderson
Timothy A. Gosselin
David E. King
John J. Konrad
Amit Kumar Sarkhel
Karl J. Puttlitz
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Citations (76)
Interfacial reaction studies on lead (Pb)-free solder alloys
2001
ECTC | Electronic Components and Technology Conference
Sung K. Kang
D.-Y. Shih
Keith E. Fogel
Paul A. Lauro
M J Yim
G. Advocate
M. Griffin
Charles Goldsmith
Donald W. Henderson
Timothy A. Gosselin
David E. King
John J. Konrad
Amit Kumar Sarkhel
Karl J. Puttlitz
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Citations (21)
1