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W. H. Wei
W. H. Wei
TSMC
High Bandwidth Memory
Interposer
Electronic engineering
Image stitching
Bandwidth (signal processing)
2
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47
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Wafer Level System Integration of the Fifth Generation CoWoS®-S with High Performance Si Interposer at 2500 mm2
2021
ECTC | Electronic Components and Technology Conference
P. K. Huang
Calvin Lu
W. H. Wei
C.C. Chiu
K. C. Ting
Clark Hu
C.H. Tsai
Shang-Yun Hou
Wen-Chih Chiou
C. T. Wang
Douglas Yu
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Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology
2017
IEEE Transactions on Electron Devices
Shang-Yun Hou
W. Chris Chen
Clark Hu
Christine Chiu
K. C. Ting
T. S. Lin
W. H. Wei
W.C. Chiou
Vic J. C. Lin
Victor C. Y. Chang
C. T. Wang
Chi-Hsi Wu
Douglas Yu
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Citations (47)
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