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Chia-Wei Chiang
Chia-Wei Chiang
Industrial Technology Research Institute
Materials science
Anodic bonding
Wafer
Composite material
Fabrication
3
Papers
11
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0
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Optimization of laser release layer, glass carrier, and organic build-up layer to enable RDL-first fan-out wafer-level packaging
2016
Alvin Lee
Jay Su
Baron Huang
Ram Trichur
Dongshun Bai
Xiao Liu
Wen-Wei Shen
Yu-Min Lin
Tao-Chih Chang
Hsiang-Hung Chang
Chia-Wei Chiang
Huan-Chun Fu
Kenneth Chen
Yu-Lan Lu
Kuan-Neng Chen
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Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology
2015
ICEP-IAAC | International Conference on Electronic Packaging and iMAPS All Asia Conference
Zhi-Cheng Hsiao
Cheng-Ta Ko
Hsiang-Hung Chang
Huan-Chun Fu
Chia-Wei Chiang
Chao-Kai Hsu
Wen-Wei Shen
Wei-Chung Lo
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A low-temperature temporary lamination and laser debonding technology to enable cost-effective fabrication of a through-glass-via (TGV) interposer on a panel substrate
2015
EPTC | Electronics Packaging Technology Conference
Alvin Lee
Jay Su
Baron Huang
Dongshun Bai
Wen-Wei Shen
Hsiang-Hung Chang
Chia-Wei Chiang
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