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Dion Manessis
Dion Manessis
Technical University of Berlin
Materials science
Soldering
Finite element method
Flip chip
Metallurgy
3
Papers
55
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Lamination and laser structuring for a microwell array
2008
DTIP | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Erik Jung
Dion Manessis
Alexander Neumann
Lars Böttcher
T. Braun
Jörg Bauer
Herbert Reichl
Bruno Iafelice
Federica Destro
Roberto Gambari
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Citations (11)
Stretchable electronic systems
2006
EPTC | Electronics Packaging Technology Conference
Thomas Löher
Dion Manessis
Ralf Heinrich
Benno Schmied
Jan Vanfleteren
Johan Debaets
Andreas Ostmann
Herbert Reichl
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Citations (31)
Thermo-Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications
2005
EMPC | European Microelectronics and Packaging Conference
Mario Gonzalez
Bart Vandevelde
Jan Vanfleteren
Dion Manessis
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Citations (13)
1